Worklog Nemo's G-wii worklog

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Would a nand flex be a good way to salvage this board? Or would that end up raising the overall difficulty.
 
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IMG_0942.jpg
After struggling with this for hours over several days, and taking a break due to a (possibly related) breakout eye infection requiring treatment by an eye specialist, I think I have cleared the bridge. I somehow doubt that this board is even remotely functional though. What do you think?
 
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It's hard to tell whether or not the NAND legs are actually soldered to the pads on the board at this point. That being said, it doesn't look like there's any bridging. Check for continuity between the top of each pin (as far away from the pad as possible) and the corresponding via to see if they're all still connected.
 
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Trace 3 and 4 are still bridged, surprisingly none of the pads lifted. I'm thinking about trying to lift the bridged pins and route more copper wires to connect them, because I don't think I can remove the solder that's bridging the pins.
 
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My neighbor suggested avoiding soldering directly to the pins and instead scratching off the coating from the traces and soldering to those points. Seemed to work better. I've cleaned up the nand significantly, and it seems to be reading as if it's not shorting anymore. I'm going to move on from this issue for now, and the backup wii has arrived so if later on I run into issues I will decide then whether to give fixing this another shot or if I will just start with the new wii.
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Just checked the resistances and they are measuring ok (120 for 1V, 8.7k for 3.3V, 50 for 1.15 on a RVK-CPU-01) so I moved on, did U10 relocation (except the pins came off so had to use u9) and then during LDO removal with hot air this happened.

IMG_1272.JPGIMG_1271.JPG
What went wrong during hot air removal? How can I avoid this in the future. Also is the board at all useable or completely trash at this point?

Also, the C3 came off slightly, is that a problem as well?

Best
 
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On the one hand, the board is literally giving me the finger, not sure what's it doing with the other hand but it can't be good.
 

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Just checked the resistances and they are measuring ok (120 for 1V, 8.7k for 3.3V, 50 for 1.15 on a RVK-CPU-01) so I moved on, did U10 relocation (except the pins came off so had to use u9) and then during LDO removal with hot air this happened.

View attachment 24805View attachment 24806
What went wrong during hot air removal? How can I avoid this in the future. Also is the board at all useable or completely trash at this point?

Also, the C3 came off slightly, is that a problem as well?

Best
Sheeeeesh, I don't think I've ever seen a fill ripped off like that before... Personally I'd trash it cause it might just not even be worth the effort trying to fix when Wiis are as cheap as they are. Others might be able to know for sure if its garbo or not?

Anyway, what happened here is that you were likely levering up on the part when the part and/or board was still cold. You should not have to apply any amount of force at all in order for that chip to come off cleanly, should just be able to be lifted off with a pair of tweezers once all the solder on all joints is melted. It can take a while because ground and voltage fills can wick away a lot of your heat, this is why it helps to preheat the board beforehand
 
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:( Thanks for clarifying. I was applying a lot of 400C heat and the C3 chip came loose, so I wanted to pry it off before it damaged anything else.
 

Stitches

2 and a Half Dollarydoos
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Something I found helps is to over-tin the pads with leaded solder before hot airing, including the big foot. Lowers the melting point and in my anecdotal experience, makes it a bit easier to remove. Also you should be cycling the air blast from the back to the front to heat it evenly, but don't use max airflow. I use 6 of 10 on mine, any higher flow rate reduces the effective air temp.

That pad rip is really just cosmetic if you were removing it for use with a PMS2. You've just lost a bit of copper, and can still supply 1.8v to the tantalum cap's positive end.

Sheeeeesh, I don't think I've ever seen a fill ripped off like that before...
I've almost done this before
20180303_162043.jpg

Since moving to the flood technique, no more issues
 
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IMO it's really not needed to use hot air on the LDO if you have an iron with decent thermal transfer. Just use a fat tip, load a ton of solder onto all of the legs and the foot, set your iron to about 700F / 375C, and rock the iron back and forth on the foot til it's ready to go (and keep the legs molten as well). It's worked 100% of the time in my experience.
 
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I am using the PMS-2 for this, so should I just carry on with the build as is, or do I need to do any recovery of the board to make it usable?

For the next trim I will definitely not use the hot air station, but the guide recommends using a dremel and that seemed like a more work and riskier, especially when many places on the forum mention using a hot air station for LDO removal.
 
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The trim is fine, just wire your 1v8 line directly to the cap. I don't even bother to dremel down the LDO before desoldering, it just speeds up the process a bit
 
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