Solved Relocating/Trimming 6-layer Documentation

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Hello, community. I have begun preparing my RVL-CPU-01 Wii motherboard for relocation and trimming, but I cannot find video/photo documentation showing what a successful 6-layer OM6 trim and Bluetooth/U10 relocation should look like. I've checked out both 'The Definitive Wii Trimming Guide' as well as the suggested '6 Layer Expansion', yet I'm having a hard time understanding the diagrams. I apologize if I missed it somewhere, but I've never used any sort of forum before, so navigation is new to me. Thank you for all suggestions, and again sorry if I just missed it.
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cheese

the tallest memer in town
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In the OM6 guide, just cut slightly outside of the marked red line and that is the trim. U10 looks the same on a 6 layer as a 4 layer, so you can use the images from the main guide for that. Bluetooth just uses the two numbered vias from the second image, and goes to the respective numbers from the 4 layer guide's pictures
 
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